The company is currently looking at both existing and greenfield sites for the new facility, which will support about 20,000 t/y of LCP production. The first phase of the project is scheduled to go into operation in 2024.
Celanese said the additional polymerization capacity will make the company the only LCP producer with assets in both Asia and the West, enabling it to work closely with customers in multiple regions. The US-based group already has LCP polymerization capability in Shelby, North Carolina, USA and LCP compounding assets in North America, Europe and China.
“5G, Internet of Things and vehicle electrification are just a few of the macrotrends driving demand for materials that support device miniaturization, improved signal integrity and circuit densification,” said Stefan Kutta, vice president, engineered materials for Celanese. “LCP is uniquely qualified to solve these challenging requirements, and this investment will support a reliable supply of LCP to a growing customer base and enable Celanese to capture additional growth in these exciting end-uses.”
He added that China continues to be a quickly growing manufacturing base for many global electronics and automotive customers and currently accounts for more than 50% of global LCP demand.
According to a December 2020 report by India’s Data Bridge Market Research, the global LCP films and laminates market will expand at a compound annual growth rate of 6.28% by 2027, driven mainly by rising demand for high-frequency electronics.
LCP films are used in the manufacture of flexible circuits and LCP laminates and used to make printed circuit boards. They are widely used in many applications, such as packaging, automotive and transportation, medical devices, among others.
Author: Elaine Burridge, Freelance Journalist
