BASF to Advance Semiconductor Manufacturing in Taiwan
BASF signed a memorandum of understanding with Taiwan's Ministry of Economic Affairs today, underscoring its long-term commitment to the growth of Taiwan's semiconductor ecosystem.
With this investment, BASF’s Electronic Materials business is expanding its site in Taoyuan, Taiwan, with additional production capacity for state-of-the-art semiconductor materials, improved quality analysis capabilities, and an expanded innovation center. The investment is intended to support the growing global demand for leading semiconductor manufacturing technologies, particularly the latest sub-2-nm technologies. At the same time, it strengthens supply chain resilience and customer proximity.
“Taiwan is a global hub for semiconductor innovation and manufacturing, featuring state-of-the-art process technologies and a highly integrated industrial ecosystem. The decision to locate the headquarters of BASF’s global business unit for electronic materials in Taiwan in 2025 reflects Taiwan’s strategic importance in the global semiconductor ecosystem and has strengthened our confidence in the market’s long-term growth potential,” said Gops Pillay, President of BASF’s Global Operating Division.
As the semiconductor industry moves toward process technologies below 2 nm, demand for advanced, high-purity specialty chemical formulations continues to rise. With the expanded facility in Taiwan, BASF will strengthen its Innovation Center and expand its technical and analytical capabilities for leading semiconductor technologies in the AI era. The investment will deepen collaboration with key customers and industry partners, enable the joint development of next-generation materials, and simultaneously solidify Taiwan’s position as a global hub for semiconductor innovation.
The investment will further strengthen BASF’s manufacturing, quality assurance, and technical service capabilities in Taiwan, offering customers more reliable supply of advanced semiconductor materials, faster technical support, and closer collaboration. At the same time, it will enhance supply chain resilience and reinforce BASF’s role as a trusted, long-term partner to the semiconductor industry.
“The signing of the letter of intent marks another important milestone in BASF’s long-term commitment to the semiconductor industry,” said Jens Liebermann, Senior Vice President of the Global Electronic Materials Business and Chairman of BASF Taiwan. “As semiconductor technologies continue to evolve, innovations in materials must keep pace with our customers’ changing needs. By strengthening our local manufacturing, innovation, and technical service capabilities, we are deepening our collaboration with our customers, accelerating the development of material solutions for future technology generations, and enhancing supply chain resilience.”
As a partner to the global semiconductor industry, BASF’s Electronic Materials business has maintained a strong presence in Taiwan for more than two decades. The company offers high-performance process chemicals and customized formulation solutions for the semiconductor and display industries, as well as specialized metal systems for consumer electronics applications.
