New materials for electronics manufacturing at the SEMICON Europa 2016
2016FLEX Europe will be presenting innovations in the flexible, printed, and hybrid electronics industry segments
The focus of the SEMICON Europa 2016 is materials and equipment for the semiconductor industry. The most significant European industry gathering will take place this year from October 25 to 27 in Grenoble (France). More than 400 exhibitors and 5500 visiting experts from all over the world are expected. This leading European trade fair for the semiconductor industry has traditionally been closely associated with a comprehensive conference program.
From high-purity gases to doping agents and from arsenic to tin, a broad spectrum of chemicals is needed to manufacture electronic components. Suppliers of these materials are an important part of the value added chain in the semiconductor industry. This is why they will be widely represented both at the fair as well as in the conference program. The SEMICON Europa 2016 program includes more than 40 industry conferences and highly competent discussion panels.
Traditionally the SEMICON Europa 2016 Markets and Executive Program has presented an overview of important trends and developments in the market. The Advanced Materials Session provides an opportunity for experts to discuss new technologies expected to gain greater importance for the industry in the year to come. This will make evident that the spectrum of substances and methods applied in the semiconductor industry will most likely broaden enormously in the future. Brandon Hirsch from KU Leuven is to present his paper “Molecular self-assembly from liquids on atomically flat surfaces: from fundamentals to applications“. “Advanced materials processing with atomic layer deposition and chemical vapor deposition precursors“ will be the topic of a presentation by Jean-Marc Girard, CTO of Air Liquide. Micheal Morris, Director of the Amber Research Centers at Trinity College, Dublin will be discussing the development of block copolymers for use in semiconductor production. This will be followed by “III-V selective area growth on Silicon: from Logic to Photonic applications“, a broader perspective by Clement Merckling from Imec.
The trade fair program at the SEMICON Europa has been continually expanding over the last few years with additions like Imaging, Power Electronics or Advanced Packaging. SEMI addresses current trends of the European semiconductor manufacturers and their suppliers that are expected to gain importance over the coming years. A new addition for this year is the 2016FLEX Europe Conference on October 25th and 26th. FlexTech, SEMI's strategic association partner, will build on and expand the Plastic Electronics’ current activities with their chosen topic of “Building the Innovation Ecosystem for Flexible Electronics“.
The new conference program has expanded accordingly. Topics range from “OLED for Automotive Applications: Status and Future Trends“, presented by Erwin Lang, Senior Key Expert OLED Technology at Osram OLED GmbH, all the way through to “Injection Molded Electronics: Mass Manufactured Smart Plastics“, presented by Antti Keränen, CTO of TactoTek. All together the eight sessions will cover subjects such as Large Area Electronics, Wearables and Implantable Applications, with Flexible Displays and Imaging, with Flexible Hybrid Electronics Manufacturing, Challenges and Solutions or with Novel and Innovative Power Sources for Flexible Electronics Applications.
The Science Park provides a direct venue for exchange between science and economy. Innovation Village will again be offering selected high-tech start-ups the possibility of presenting their projects and products to potential customers and partners as well as to interested investors.